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Series :
Contact Finish - Mating :
Number of Positions or Pins (Grid) :
27434 products
IMAGE PART NO. PRICE QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
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Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
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Samtec Inc. CONN SOCKET PLCC 32POS TIN PLCC Obsolete   -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin   Tin 32 (2 x 7, 2 x 9) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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Per Unit
$188.6880
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3M BGA 1MM 25 25MM 23 MATRIX 168PIN   Active                                
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Per Unit
$154.1100
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3M BGA SOCKET 1MM 676 POS 26X26   Active           BGA                    
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$91.6360
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3M 10X10 GRID ZIP SOCKET   Active   -55°C ~ 150°C Through Hole Solder Closed Frame   Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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$57.8180
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3M BGA 1.00MM 9X9 8X8 64 PIN   Active                                
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Per Unit
$34.4000
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TE Connectivity AMP Connectors CONN SOCKET LGA 2011POS GOLD   Active     Surface Mount Solder Open Frame LGA Thermoplastic   Gold 30.0µin (0.76µm) Gold 2011 (47 x 58) Copper Alloy   30.0µin (0.76µm) Copper Alloy
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$16.1600
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TE Connectivity AMP Connectors DUAL LGA,257 POS, DMD SOCKET DMD Active   -25°C ~ 100°C Surface Mount Solder Board Guide, Open Frame LGA Thermoplastic 0.039" (1.00mm) Gold 3.00µin (0.076µm)   257 (20 x 30) Copper Alloy      
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Per Unit
$14.2600
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TE Connectivity AMP Connectors CONN SOCKET LGA 1151POS GOLD   Active     Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) Gold 1151 Copper Alloy 0.036" (0.91mm) 15.0µin (0.38µm) Copper Alloy
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Per Unit
$6.4400
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder   SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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$6.1600
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$5.2400
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$4.3900
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$2.4500
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$2.4300
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$2.0900
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$1.6600
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
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Per Unit
$1.5400
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
D01-9933246
Per Unit
$7.3000
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100
In-stock
Harwin Inc. CONN SOCKET SIP 32POS TIN D01-993 Active   -55°C ~ 125°C Through Hole Solder Cup   SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin   Tin 32 (1 x 32) Brass 0.100" (2.54mm)   Brass
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Per Unit
$2.7500
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Per Unit
$1.8981
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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700
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
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Per Unit
$2.1600
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700
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
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Per Unit
$1.2723
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700
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 16 (2 x 8) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Per Unit
$1.4100
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Per Unit
$0.9520
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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275
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS TIN Active                                
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